valutazioni - 5, GPA: 3.6
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These transceivers are all supplied in the new industry standard 1x9 SIP package style with either a duplex SC or a duplex ST* connector interface. ATM 2000 m Backbone Links The HFBR-5205/-5205T are 1300 nm products with optical performance compliant with the SONET STS-3c (OC-3) Physical Layer Interface Specification. This physical layer is defined in the ATM Forum User-Network Interface (UNI) Specification Version 3.0. This document references the ANSI T1E1.2 specification for the details of the interface for 2000 meter multimode fiber backbone links. Selected versions of these transceivers may be used to implement the ATM Forum UNI Physical Layer Interface at the 155 Mbps/194 MBd rate. The ATM 100 Mbps/125 MBd Physical Layer interface is best implemented with the HFBR-5100 family of FDDI Transceivers which are specified for use in this 4B/5B encoded physical layer per the FDDI PMD standard. HFBR-5203/-5203T 800nm 300 m HFBR-5204/-5204T 1300 nm 500 m HFBR-5205/-5205T 1300nm 2 km ATM 500 m Backbone and Desktop Links The HFBR-5204/-5204T are 1300 nm products which are similar to the HFBR-5205/5205T except that they are intended to provide a lower cost SONET OC-3 link to distances up to 500 meters in 62.5/125 mm multimode fiber optic cables. Very Low Cost ATM 300 m Desktop Links The HFBR-5203/-5203T are very low cost 800 nm alternatives to the HFBR-5204/-5204T for SONET OC-3 links to distances up to 300 meters in 62.5/125 mm multimode fiber optic cables. Transmitter Sections The transmitter sections of the HFBR-5204 and HFBR-5205 series utilize 1300 nm InGaAsP LEDs and the HFBR-5203 series *ST is a registered trademark of AT&T Lightguide Cable Connectors. 2 uses a low cost 800 nm AlGaAs LED. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC which converts differential PECL logic signals, ECL referenced (shifted) to a +5 Volt supply, into an analog LED drive current. Receiver Sections The receiver sections of the HFBR-5204 and HFBR-5205 series utilize InGaAs PIN photo- diodes coupled to a custom silicon transimpedance preamplifier IC. The HFBR-5203 series uses the same preamplifier IC in conjunction with an inexpensive silicon PIN photodiode. These are packaged in the optical subassembly portion of the receiver. These PIN/preamplifier combinations are coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The data output is differential. The signal detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +5 volt power supply. Package The overall package concept for the Agilent transceivers consists of three basic elements; the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagrams in Figure 1 and Figure 1a. The package outline drawing and pin out are shown in Figures 2, 2a, and 3. The details of this package outline and pin out are compliant with the multisource definition of the 1x9 SIP. The low profile of the Agilent transceiver design complies with the maximum height allowed for the duplex SC connector over the entire length of the package. The optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost effective building block. The electrical subassembly consists of a high volume multilayer printed circuit board on which the IC chips and various surface- mounted passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to insure low EMI emissions and high immunity to external EMI fields. The outer housing including the duplex SC connector or the duplex ST ports is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. The solder posts of the Agilent design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the duplex or simplex SC or ST connectored fiber cables. Note: The “T” in the product numbers indicates a transceiver with a duplex ST connector receptacle. Product numbers without a “T” indicate transceivers with a duplex SC connector receptacle. Application Information The Applications Engineering group in the Agilent Optical Communication Division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. You can contact them through your Agilent sales representative. Figure 1. Block Diagram. DATA OUT SIGNAL DETECT OUT DATA IN ELECTRICAL SUBASSEMBLY QUANTIZER IC DRIVER IC TOP VIEW PIN PH...